logo

Newsletters

November 28, 2017

Welcome to the Pixus Technologies Newsletters. We have four newsletters according to our product divisions. Sign up for as many of the newsletters as you like.  You can opt-out at anytime. Click on the "Link to Quick Sign-up Form" link to open the form page.

Sign-Up

Link to Quick Sign-up Form

Newsletter Archive


Mar/Apr -  OpenVPX Specialty Components, Aesthetic Instrumentation Enclosures 

Feb 2018New CompactPCI Serial System, Mixing Air and Conduction Cooled Modules, & More 

Jan 2018Superior Cooling for OpenVPX and Other Chassis Platforms, New CompactPCI Serial System 

Nov 2017 - OpenVPX Components and Specialty Boards                     

Aug 2017 - New OpenVPX Enclosures & Components, New Articles

Apr 2017 - Efficient Cooling for Rackmount Embedded Computers

Feb 2017 - Creative Conduction-Cooling Solutions for Superior SWaP

Jan 2017 - Rugged OpenVPX Rackmount Systems

Dec 2016 - Cooling Instrument Cases

Oct 2016 - Advanced Cooling for 3U and 6U Systems

Sept 2016 - OpenVPX Development System

July/Aug 2016 - Articles & White Papers from Pixus

May 2016 - Conduction Cooled for Low SWaP 

April 2016 - OpenVPX Backplane Design

March 2016 - Powerful Front-to-Rear Cooling Solutions

February 2016 - Get Help in Configuring Your Embedded System

November 2015 - The Embedded Architecture Industry Swap

September 2015 - Improving Your Enclosure Design While Reducing Costs